SCANNING ELECTRON MICROSCOPY ACCESSORIES
SEMICAPS-Technology Associates specializes in the manufacture of
Liquid Crystal Analysis Kit and Cross-Sectioning Kit accessories.
Many yield and field failures involved excessive current flow; ESD,
resistive gate shorts, conductor-to-conductor shorts are examples.
Devices with local hot spots are less reliable, leading to early
failures. Liquid crystal analysis kit 4300 provides an unsurpassed
method to precisely identify points where heat is generated, down to
20mW. This non-destructive method enables an analyst to "see" hot
spots through a probe station microscope with polarised light
Liquid Crystal Kits
Liquid crystal hot spot detection kit 4300 contains
- Complete illustrated procedure
- Liquid crystal A
- Syringes and spreading strips
- Switching module
Power devices or latch-up and second breakdown failures involved
higher temperatures. Kit 4330 is similar to kit 4300 except
additional Liquid Crystal B and C are provided. Liquid Crystal B and
C have sensitivity at higher temperatures needed for these types of
failures. These liquid crystals span the temperature range from 30
deg C to 100 deg C.
NMOS ASIC: ESD failure, dissipating 25mW, 20mm hot spot near a bond
pad, located by LC kit
Precision Non-encapsulated Cross-Sectioning Kits Industry proven
non-encapsulated cross sectioning kits and accessories enable the
inexperienced and experienced to routinely make superb precision
cross sections for process and yield control, and for failure
analysis. It is ideal for SEM analysis, simple enough for daily
quality inspections, but precise enough for detailed analysis.
The kit 5115 with the new adjustable mounting fixture provides a
fully adjustable cross section plane, within +/- 2 deg side to side.
This capability makes routine cross sectioning easier than ever. For
TEM analysis, this adjustable mounting fixture is needed to produce
Specific Area Cross Section for TEM (SAXTEM) samples.
It is an unsurpassed method to precisely polish a multilayer sample
structure to within 0.1mm of a desired location.
Areas of application include the following:
- Small diodes to very large VLSI silicon
- Device chips
- Fiber optics
- GaAs device chips and wafer pieces
- Thin film - single and multiple layers consisting of metals,
polycrystalline silicon, nitrides and polymides etc.